The ManPack is designed to accommodate one X9 Mission or Server computers and provide all the cooling required in an application where no cold plate is available, such as a wearable or UAV application. The X9 Host computer fits inside the ManPack enclosure via Quad DuoLock™™ wedgelocks (patent pending) and suspends the Host computer allowing airflow on all four sides of the X9 Host computer.

The two high-speed, sealed, rugged fans take air from the top of the enclosure and force air through the fins of the X9 for optimum cooling on all four sides. The X9 Host Landing Pad on the back side of the unit is connected directly with the X9 ManPack fan assembly and provides power and tachometer to each fan individually. The fan assembly communicates with the Host processor via SMB thus full control over speed and status of the cooling is provided at all times.

The X9 Spider Host is a breakthrough in technology and contains many industry firsts in hardware, mechanical, interconnect and thermal innovations. With over 26 patents, its ultra-small, high performance, space optimized CPU board, I/O bandwidth (455Gbps) and its unique stackable mechanical design, X9 modules can be configured into any system imaginable.

Featuring the world’s first rugged (IP67) 40Gbps connectors which provide 100W of power up to 50 meters, the X9’s power delivery, management and density is unmatched in today’s market.

It’s unique design utilizes patented RuggedCool™ technology to provide four-sided cooling for balanced heat transfer and low thermal gradient allowing for full operation at up to +85°C.