World's Smallest, Fully-Rugged Mission Computer with Vast I/O Expansion


Intel® XEON™ W CPU
8 Cores @ 4.7GHz (Turbo)




4x ThunderBolt™ 4 w/100W
4x 100GigE & NVIDIA® GPGPU*


5G Cell / Wi-Fi-6 /


  • Highest SWaP and performance available in a rugged system
  • Ultra-small at 6”x4.75”x2” and 2.1lbs.
  • Intel® XEON™ W with 8 cores and 24MB of smart cache
  • Operating at 2.6GHz with 4.7GHz Turbo
  • Embedded CPU roadmap for long life cycle
  • Up to 128GB of DDR4 RAM with ECC
  • Up to 16TB of native high-performance SSD
  • 4x ThunderBolt™4 ports each with 100W power delivery
  • 1x 100W expansion site with x10 PCIe Gen4 (RMC-100)
  • 1x 50W expansion site with x14 PCIe Gen3/4 (RMC-50)
  • 3x M.2 I/O expansion sites for WiFi/BlueTooth/Cell/GPS
  • System I/O port with USB/COM/GPIO/SAM™ I/O
  • Shock, Temperature and Tamper sensors
  • 8x tri-color LED’s for status and messaging
  • Single +20VDC power operation
  • Dual fan control with tachometer for external cooling


  • Hosts one X9 computer for standalone operation
  • Provides four-sided cooling for X9 Host computers
  • Only 7.25”x5.5”x2.65”
  • Two high speed rugged, sealed-bearing fans w/ tachometer
  • Vapor phase cooling for efficient cooling
  • Direct connect to Host w/o cables/connectors
  • Communicates with Host over SMB
  • Fan speed/Tachometer for safe/quiet operation
  • Rugged waterproof operation (IP67)
  • Host CPU may easily be removed via DuoLock™
    wedgelocks (patent pending)


Packaging Features
  • Fully-sealed, submersible and conduction cooled
  • Stackable, modular, interlocking enclosures (pat. pending)
  • Rugged “QuadroLock” wedgelocks secure systems together or in a separate chassis (pat. pending)
  • Fully-rugged high speed 40Gbps connectors (pat. pending)
  • Ultra-small, fully rugged “Smart” 700W power connector with ultra-low EMI (pat. pending)
  • Connectors for Quad 100GB fiber, 4x ThunderBolt™ 4,
    System I/O, 8x Antennas, 4x Coax video and Service port
  • Self-retaining dust caps for each I/O connector
  • Over 30 Rugged Mezzanine Carriers (RMC) for easy system customization and expansion
  • MIL-STD 1275 Power Supply with Boost and 50m/s hold
  • 4x Isolated ThunderBolt™4 power for each port at 100W
  • UPS backup Power Supply for hours of operation
  • External cooling with sealed fans for wearable applications
  • Over ten X9 support modules (Switch, Storage, I/O, AI etc.)
  • Mounting plates with or without radiators for various flexible mounting positions in any orientation
  • Available in low-cost industrial grade or fully rugged (R5)
  • Fiber ThunderBolt™4 (LightBolt™) connectors delivering 100W power up to 50 meters


The ManPack is designed to accommodate one X9 Mission or Server computers and provide all the cooling required in an application where no cold plate is available, such as a wearable or UAV application. The X9 Host computer fits inside the ManPack enclosure via Quad DuoLock™™ wedgelocks (patent pending) and suspends the Host computer allowing airflow on all four sides of the X9 Host computer.

The two high-speed, sealed, rugged fans take air from the top of the enclosure and force air through the fins of the X9 for optimum cooling on all four sides. The X9 Host Landing Pad on the back side of the unit is connected directly with the X9 ManPack fan assembly and provides power and tachometer to each fan individually. The fan assembly communicates with the Host processor via SMB thus full control over speed and status of the cooling is provided at all times.

The X9 Spider Host is a breakthrough in technology and contains many industry firsts in hardware, mechanical, interconnect and thermal innovations. With over 26 patents, its ultra-small, high performance, space optimized CPU board, I/O bandwidth (455Gbps) and its unique stackable mechanical design, X9 modules can be configured into any system imaginable.

Featuring the world’s first rugged (IP67) 40Gbps connectors which provide 100W of power up to 50 meters, the X9’s power delivery, management and density is unmatched in today’s market.

It’s unique design utilizes patented RuggedCool™ technology to provide four-sided cooling for balanced heat transfer and low thermal gradient allowing for full operation at up to +85°C.


  • SWaP-E:

    World’s smallest, server-class system with 4x ThunderBolt™4,
    Quad 100GigE and vast sensor I/O

  • Size:

    6” x 4.75” x 2”

  • Weight:

    2.1 lbs.

  • Power:

    Configurable to 100W or less “no Power Delivery”
    110/220 VAC (60 Hz) option available

  • MIL-STD:

    MIL-STD: MIL-STD-810, MIL-S-901, MIL-STD-461, 
    DO-160, optional MIL-STD-704

  • Temperature:

    Operates over extended temp -40°C to +85°C



* Available with optional GMS RMC-50

Our Mission

Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.

All GMS products are proudly designed and manufactured in the U.S.A.

Contact Us

General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91737

Local (909) 980-4863
Toll Free (800) 307-4863

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