The IFR02-01 “Yeti” is designed to maximize thermal management for high density and high powered computing devices in any environment. The Yeti can be used in military, industrial and commercial platforms. It can be mounted virtually anywhere—including on air/ground/sea vehicles, telephone poles and powered by solar panels. The IFR02-01 is fully compliant to MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD-461E and has ingress protection up to IP67.

The IFR02-01 “Yeti” is an intelligent cold plate thermal management device designed to provide the most efficient cooling for high-powered and high-performance computing devices. It is optimized to work with GMS rugged conduction-cooled chassis and systems, keeping them within temperature limits when a suitable cold plate is unavailable. Utilizing dual temperature sensors on the cold plate and an internal cooling chamber, the Yeti can reliably report operational temperature, fan RPM and configuration settings so that the dual independently controlled fans can automatically regulate the attached system's temperature. Using GMS’s TwoCool™ redundant fans for increased MTBF, the fan motors are sealed from the elements for high operational reliability so that the Yeti truly provides the highest level of system, thermal performance, and SWaP in a ruggedized, sealed conduction-cooled chassis, operating from -40ºC to +85ºC. With its own MIL-STD-1275 power conditioning module, the Yeti can be deployed in the field and utilize the same power source as the computing device. This system architecture simplifies applications that require the highest computing density and no legitimate thermal path to conduct the heat by providing intelligent cooling within the footprint of the attached computer system or chassis. The Yeti is a small, ultra-rugged enclosure with the greatest possible performance per dollar and per watt.

Additional information regarding the ruggedization levels and full environmental specifications for this product can be found on our website at www.gms4sbc.com/technologies/ruggedization.

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