Originally Published in the April Issue of MILITARY & AEROSPACE ELECTRONICS

MILITARY & AEROSPACE ELECTRONICS, VOL. 27, NO. 4, April, 2016 – In John Keller’s write up on “Beating the Heat” in the April 19, 2016 edition of Military & Aerospace Electronics, he examines the variety of ways to keep cool systems designed for military and defense. General Microsystems’ Chief Architect Ben Sharfi was John’s go-to guy for “the demands for high performance in embedded cooling”.

GMS’s Ben Sharfi comments on our patent-pending RuggedCool℠ technology. It is a unique conduction-cooled thermal system that allows the industry’s hottest components to run at full speed over a wide temperature range from –40C to +85C. More importantly: the components operate at their maximum performance, with no need for “clock throttling” that slows the processor down as a way of lowering heat. All GMS rugged small form factor systems employ RuggedCool℠ as a way of reliably placing the industry’s highest-performing Intel processors in the most demanding environments.

 

Read the full article here.

 

April, 2016

By John Keller

Editor-in-Chief, M&AE