THE WORLD'S SMALLEST BATTLEFIELD MISSION SYSTEM WITH FULL CPU, GPU, STORAGE HIGH SPEED I/O

Intel® 8 Core

CORE™ i7 11th GEN

Up to 2.6 GHz (4.6 GHz Burst)

Upgradeable DIMMs

64GB DDR4

PC3200 ECC

Dual 100Gb Ethernet

4x Thunderbolt™ 4 and Dual 100GigE

GPGPU or x16 Expansion

2x 10 GigE Base-KR

6x USB-C

4x with 100W+ Pwr

SYSTEM HIGHLIGHTS

I/O and Expansion Options

- Intel® Tiger-H up to 8 cores (Intel® Xeon® W) with 64GB DDR4 ECC DRAM

- 4x Thunderbolt™ 4 with DisplayPort and 100W power

- Thunderbolt™ 4 available as Copper or Fiber cable with power delivery over 50m

- NVIDIA RTX5000 GPGPU (PCIe Gen4) or: 3x additional TB4 and 2x M.2

- Dual 100GigE Ethernet ports with Fiber Interface

- Quad M.2 sites to support Wi-Fi, MIL STD-1553, Cellular and GPS

- Dual M.2 80mm for high performance SSD (x4 PCIe Gen4, x2 PCIe Gen3)

- Embedded System Controller for power management

- Shock, Temperature and Tamper sensors for safe operations

- Operates on a single +24 VDC

- Four Thunderbolt™ 4/LB™ ports with optional 100W

- 4x DisplayPort HD video 3840 x 2160 UHD via Thunderbolt 4 ports

- Dual 100Gb Ethernet fiber ports

- Up to six M.2 sites for SSD storage or I/O

- Three USB 2.0 ports  

- Two COM serial ports (RS-232/422/485)

- Eight GPIO ports

- Real Time Clock (RTC) with battery

- Trusted Platform Module (TPM) 2.0 for secure boot operation

- GMS SecureDNA™ panic support for system Zeroize

- Anti-tamper plus temperature and shock sensor(s)

- MIL-STD-1275-style power via regulated 24VDC input

- I/O via MIL-circular connectors (optional GMS-style Type-C)

- IP66 rated for particulate and water ingress protection

- GMS LightBolt™ connectors with Type-C copper inserts

X9 SPIDER DISTRIBUTED SYSTEM

FAMILY OF PRODUCTS

X9 DISTRIBUTED SYSTEM ADVANTAGE

The X9 modular, scalable, distributed architecture simplifies applications that require rugged high-performance computing, high-definition video, sensor processing, artificial intelligence (AI) battlefield edge processing, storage, display, and I/O in a small, rugged enclosure with amazing performance per dollar per Watt. All X9 products are modular, expandable or scalable, with Thunderbolt™ 4 technology and our patented LightBolt™ 40Gbps connections in copper or fiber, with optional 100W per port power for up-/down-stream sensors and system expansion.


THE WORLD'S FIRST ULTRA-MOBILE / SCALABLE

SINGLE BOARD 3U VPX SYSTEM

Aligned with the SOSA™ Technical Standard

Intel® 8 Core

CORE™ i7 11th GEN

Up to 2.6 GHz (4.6 GHz Burst)

Upgradeable DIMMs

64GB DDR4

PC3200 ECC

Dual 100Gb Ethernet

4x Thunderbolt™ 4 and Dual 100GigE

GPGPU or x16 Expansion

2x 10 GigE Base-KR

6x USB-C

4x with 100W+ Pwr

SYSTEM HIGHLIGHTS

- Extensible open-standards “single-board systems” that scale up and out via high-speed USB4 and 100Gb Ethernet

- Intel® Tiger Lake-H up to 8 cores (2.6GHz, 4.6GHz Turbo Boost)

- 64GB DDR4 ECC DRAM via upgradeable SO DIMMs

- Boasts massive 455 Gbits/s bandwidth to external I/O

- x16 and x8 PCIe Gen 4 onboard/off-board inter-connect fabric with optional fiber extender frees OpenVPX bus

- Full size MXM for GPGPU, FPGA, or bus extension

- 4x USB4/Thunderbolt™ (40Gbps each) USB-C with optional fiber (100m) and 100W+ Power Delivery (each)

- Dual 100Gb Ethernet ports - Dual 10 GigE Base-KR to VPX (P1)

- RAID-capable, quad M.2 sites for storage or I/O

- 2x USB 3.2 Gen 1 (5 Gbps) via USB-C w/power for console and I/O

- 1x GigE, 8x GPIO, 2x COM, 2x USB, SATA/PCIe to VPX (P2)

- Dual SAM™ I/O add-in modules for MIL-1553, ARINC-429, NTDS, GPS, or legacy I/O

- GMS-patented cooling rails and floating “clamshell” for superior cooling, shock/vibration tolerance and reliability (USPTO: 4456790)

- TPM 2.0 for root of trust, Secure Boot or Windows 10/11

- Display Port/DVI to VPX (P2)

- Embedded System Controller for Control Plane / Intelligent Power

- Operates on single 12 VDC supply from VPX backplane

- VITA 65 profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16

- Modular stack (CPU/Carrier/HSIO) for upgradeable processor and OpenVPX pinout/profile changes without changing backplane

- Available as single- or dual-slot air- or conduction-cooled modules (1” pitch for conduction, 0.8” pitch for convection)


Our Mission

Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.

All GMS products are proudly designed and manufactured in the U.S.A.

Contact Us

General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91737

Local (909) 980-4863
Toll Free (800) 307-4863

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