3U OPENVPX MISSION PROCESSOR SYSTEM GPU;TWO SLOT EXPANSION

CONDUCTION-COOLED 3U OPENVPX 3-SLOT SYSTEM

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PROCESSOR SLOTS

Intel^® Xeon^® D/W CPU
Up to 20 Cores
128 GB DDR4 w/ECC

OpenVPX EXPANSION

2x Expansion Sites at 1” pitch
- GMS X9 VENOM™ modules
- User-defined modules

MASS STORAGE

4 TB removable total
(fully populated)
CSfC, FIPS 140-2

PANEL ETHERNET

Up to 6x 100 GigE fiber
Up to 6x 10 GigE copper
Up to 9x 1 GigE

OVERVIEW

Pre-configured or user-customizable compact 3-slot 3U OpenVPX (VITA-65) 500W chassis
Accommodates high TRL GMS X9 VENOM modules and user-defined 3U OpenVPX modules on two 1” pitch backplane slots
Ultra-dense I/O possible for custom configurations
SOSA-aligned and intended for MOSA requirements

CHASSIS

Under 11 pounds in “full up” configuration – all sites populated; 5 pounds empty
Reliably dissipates up to 500 W in “full up” configuration – all sites populated
Tray, DZUS or vetronics-style mount; custom available

SECURITY

IPMI integrates with GMS Enhanced SecureDNA® chassis manager, and drive(s)
Front-panel hardware secure erase with BIOS erasure.
Optional FIPS 140-2 SSD, with hardware secure erase
Includes anti-tamper switches, Intruder signal, embedded sensors

CPU ONLY CONGURATION (1 SLOT ONLY)

X9 VENOM™: Host CPU only
- Intel® Xeon® D-2700 (20 Cores, 3.2 GHz) or
- Xeon® W (8 Cores, 4.7 GHz)
- Up to 128 GB DDR4 ECC DRAM
2x 10 GigE copper to panel
2x 100 GigE fiber to panel
Thunderbolt™ 4, 40 Gbps each each with 100 watts Power Delivery to panel, up to 6 ports
- Optional: 2x ports front panel, 4x ports rear panel
- Optional GMS LightBolt™ fiber support for transmission to 50 m.
Optional SSD removable storage (M.2 2280) – 2 TB max with optional FIPS 140-2, CSfC
Optional service port access with USB 2.0, Video, Serial COM, 5x General Purpose I/O (GPIO)

CPU + I/O CONFIGURATION: TWO OR THREE SLOTS (TOTAL)

Increased I/O capabilities over CPU-only configuration
- Single slot VENOM™ high speed modules (Switch, AI)
- Third party or user-defined 3U OpenVPX modules
- Supports dual slot VENOM™ (NAS and NET) modules – extremely low latency for high performance computing (HPC) without using the backplane
Adds 2x optional 100 GigE fiber per slot
Adds fixed M.2 2280 SSD per slot; 2 TB max each
Optional Additional service port I/O per slot
Optional SAM™ I/O expansion: Wi-Fi®, Bluetooth®, Cellular

GENERAL DESCRIPTION

X10 Mission Processor system is a pre-configured compact 3-slot 3U OpenVPX (VITA-65 compliant) conduction-cooled chassis. It complies with IEEE-1101.2 slot cards with a 1.0-in. pitch high-density backplane. Standard configuration includes either a GMS single-slot VENOM™ Intel® 8C (Tiger Lake) or 20C (Xeon® D Ice Lake) single-board computer (SBC) and two slots. One slot can be equipped with a GMS GPGPU module or high-density Ethernet switch card, or both spare slots can be used for user I/O. SOSA-aligned, the chassis conforms with the Open Group® specification or can be maxed out with Thunderbolt™ 4 I/O with Power Delivery, 100 GigE (fiber), and more.

At the center of GMS’s X10 GENESIS Mission Processor System is the X9 VENOM™ 3U OpenVPX mission processor module, available both in single slot and dual slot versions with Intel Xeon® W (8 cores) or Xeon D (20 cores). Intel®’s next generation CPU (Xeon® W or Xeon® D) offers scalability with high-density performance.

The X9 VENOM™ family is the ultimate in 3U OpenVPX products and is designed for MOSA (Modular Open Standard Approach) and developed in alignment with the SOSA™ Technical Standard. SOSA profile is SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16.

X9 VENOM™’s patented wedgelocks and clamshell heatsink design employs GMS’s patented RuggedCool® and Diamond RuggedCool2™ cooling technology by providing a larger and more direct heat path from the OpenVPX LRU heat plane to the chassis for long life in extended temperature environments.

Two expansion OpenVPX sites are provided for additional I/O and can be configured to match customer needs. Available capabilities include an Ethernet switch, NVIDIA®-based GPGPU for AI applications, NAS (network attached storage), fiber Ethernet, FPGA co-processing logic and more. The chassis front panel can be modified for the extra I/O from the expansion slots.

High-speed I/O to and from the fully populated Mission Processor system (populated with three GMS VENOM™ payload modules) is via optional Thunderbolt 4 at 40 Gbps transfer or the Ethernet interfaces (up to 6x 100 GigE fiber, up to 6x 10 GigE, and up to 9x 1 GigE).

ENVIRONMENTAL SPECIFICATIONS

Size:

4” (H) x 4.75” (W) x 9” (D)
Weight:

11 lbs.
Power (W):

500 W max
Operates on +28 VDC MIL-STD-1275 power
accepts wide range of input voltage
Includes UPS with 50 ms hold-up
MIL-STD:

MIL-STD-810, MIL-S-901, MIL-STD-461,
DO-160, optional MIL-STD-704
Temperature:

Operates over extended temp -40°C to +85°C

BLOCK DIAGRAM

Our Mission

Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.

All GMS products are proudly designed and manufactured in the U.S.A.

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General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91730

Local (909) 980-4863
Toll Free (800) 307-4863

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