Rugged, Sealed, Removable Conduction Cooled U.2 I/O Card with Thunderbolt™ 3 via USB-C, M.2 NVMe SSD and SAM I/O
Features
- Removable U.2 form factor with NVMe interface supporting four lanes PCIe Gen 3
- Dual Thunderbolt™ 3 via USB-C
- Up to 40 Gbps data transfer
- Up to 27 W power delivery for each USB-C interface
- USB 2.0 and USB 3.1 sideband channel per USB-C interface
- Daisy chain capability
- Optional locking connector (lose dual Type-C)
- Optional fixed M.2 SSD (optional encrypt/Secure Erase/Write Protect)
- M.2 site may also be substituted for I/O via HD-BNC connector
- One SAM I/O site for custom I/O
- HD-BNC or standards-specific connector for MIL-STD-1553, ARINC-429, Wi-Fi/BT, GPS, etc.
- Voltage/Temperature Monitoring Sensor on I2C bus
- 12V and 3.3V power input
SWaP-E (Size, Weight and Power - Efficiency)
- Industry's only U.2 module for TB 3 and expansion I/O utilizing NVMe interface (x4 PCIe Gen 3 lanes)
- Ultra-low SWaP at 2.6" x 0.5" x 4.0" (w x h x d), @ 0.5 lbs. and as low as 10 W - MIL-STD-810G, MIL-S-901D, DO-160D, MIL-STD-461E, IP64 compliant
- Operates up to extended temp -20°C to +75°C (Optional)
- Available in ruggedization levels R1-R3