Systems that Match Performance to your Program’s Packaging Requirements
As rugged systems requirements become more demanding, it is critical to have the ability to select different packaging options in order to achieve the optimal result. GMS, which continues to define the industry’s direction in the design and manufacture of board and system-level products, has taken the lead on this concept with three series of system offerings that comprise the very latest in embedded computing technology.
GMS systems are targeted for applications where traditional VPX/VME/cPCI ATR packaging (card cage, power supply, fan trays, etc.) can not be considered due to size, weight, cost or other limiting factors. GMS systems pack the most performance with the lowest power consumption in the smallest package possible. All of our systems use only embedded devices to provide long life cycles, and to withstand harsh environmental conditions for Mil/Aero applications - meeting MIL-STD-810G, MIL-STD-1275D, MIL-STD-901D, MIL-STD-461E, DO-160D and IP67, to name a few.
Our products are broken down into the following product categories:
Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.
All GMS products are proudly designed and manufactured in the U.S.A.
General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91737
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